Servisol 25g High Thermal Conductivity Heatsink Compound Paste

The Servisol 25g Heatsink Compound Paste is an essential silicone-based thermal interface material designed to enhance thermal conductivity between heat sinks and electronic components like transistors and semiconductors. This non-flammable compound ensures a positive heatsink seal and maintains high thermal stability across a wide temperature range, making it ideal for various applications in electronics.

Features

• Silicone-Based Formula: Provides excellent thermal conductivity for effective heat transfer.
• Non-Flammable: Safe to use in various electronic applications without risk of ignition.
• High Thermal Stability: Operates effectively within a working temperature range of -50°C to +200°C.
• Easy Application: Supplied in a convenient 25g tube for straightforward application.

Specifications

• Brand: Servisol
• Material: Zinc Oxide
• Working Temperature Range: -50°C to +200°C
• Package Size: 25g